Magnetic Field Sensor With Shared Path Amplifier And Analog-To-Digital-Converter

ABSTRACT

A magnetic field sensor comprises at least one magnetic field sensing element configured to generate a measured magnetic field signal responsive to an external magnetic field; a diagnostic circuit configured to generate a diagnostic signal, wherein the diagnostic signal is not dependent on a measured magnetic field; a signal path comprising an amplifier and an analog-to-digital converter for processing the measured magnetic field signal to generate a sensor output signal indicative of the external magnetic field during a measured time period and for processing the diagnostic signal during a diagnostic time period; and a switch coupled to receive the measured magnetic field signal and the diagnostic signal and direct the measured magnetic field signal to the signal path during the measured time period and direct the diagnostic signal to the signal path during the diagnostic time period.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a CONTINUATION-IN-PART of U.S. patent application Ser. No.14/541,582 (filed Nov. 14, 2014); a CONTINUATION-IN-PART of U.S. patentapplication Ser. No. 14/541,454 (filed Nov. 14, 2014); and aCONTINUATION-IN-PART of U.S. patent application Ser. No. 14/541,735(filed Nov. 14, 2014); all of which are incorporated here by referencein their entireties.

FIELD

This invention relates generally to magnetic field sensors and, moreparticularly, to magnetic field sensors with self-calibration circuitryand techniques.

BACKGROUND OF THE INVENTION

Magnetic field sensors including a magnetic field sensing element, ortransducer, such as a Hall Effect element or a magnetoresistive element,are used in a variety of applications to detect aspects of movement of aferromagnetic article, or target, such as proximity, speed, anddirection. Applications using these sensors include, but are not limitedto, a magnetic switch or “proximity detector” that senses the proximityof a ferromagnetic article, a proximity detector that senses passingferromagnetic articles (for example, magnetic domains of a ring magnetor gear teeth), a magnetic field sensor that senses a magnetic fielddensity of a magnetic field, and a current sensor that senses a magneticfield generated by a current flowing in a current conductor. Magneticfield sensors are widely used in automobile control systems, forexample, to detect ignition timing from a position of an enginecrankshaft and/or camshaft, and to detect a position and/or rotation ofan automobile wheel for anti-lock braking systems.

Magnets, in the form of a permanent magnet, or magnetically permeablestructures, sometimes referred to as concentrators or flux guides, areoften used in connection with magnetic field sensors. In applications inwhich the ferromagnetic target is magnetic, a magnetically permeableconcentrator or magnetic flux guide can be used to focus the magneticfield generated by the target on the magnetic field transducer in orderto increase the sensitivity of the sensor and, allow use of a smallermagnetic target, or allow the magnetic target to be sensed from agreater distance (i.e., a larger airgap). In other applications in whichthe ferromagnetic target is not magnetic, a permanent magnet, sometimesreferred to as a back bias magnet, may be used to generate the magneticfield that is then altered by movement of the target.

During manufacturing or during use in application, magnetic fieldsensors (and other parts) sometimes present failures. These failures maybe due to manufacturing defects, design defects, latent failures, or acombination of both. Magnetic field sensors can also develop faultsafter they are installed in a working environment.

To reduce the occurrence of defective parts entering the field, partsare often tested during or after the manufacturing process. Some partshave been designed to include self-test capabilities, i.e. internalcircuitry included in the part that can be used by the part to testitself during manufacturing. These self-tests may include built-inself-tests (i.e. “BIST” tests). During a so-called logical-BIST (i.e. an“LBIST” test), for example, the internal registers within the part areconnected together in a scan chain so that the output of one leads tothe input of the next. Data is fed through the scan chain and the resultis compared to an expected value. If the result does not match theexpected value, it may indicate there is a defect in the part. Certainparts may also include other types of BIST or self-test circuitryincluding tests that check the integrity of analog circuits.

Circuits or parts that perform testing on themselves cannot alwaysachieve a desired level of test coverage. For example, it may bedifficult or costly to design test circuits that test certain othercircuits within the part. As another example, once a part is installedin its operating environment, certain types of self-tests may interruptoperation or degrade performance of the part if performed while the partis under operation.

SUMMARY

In an embodiment, a magnetic field sensor comprises at least onemagnetic field sensing element configured to generate a measuredmagnetic field signal responsive to an external magnetic field; adiagnostic circuit configured to generate a diagnostic signal, whereinthe diagnostic signal is not dependent on a measured magnetic field; asignal path comprising an amplifier and an analog-to-digital converterfor processing the measured magnetic field signal to generate a sensoroutput signal indicative of the external magnetic field during ameasured time period and for processing the diagnostic signal during adiagnostic time period; and a switch coupled to receive the measuredmagnetic field signal and the diagnostic signal and direct the measuredmagnetic field signal to the signal path during the measured time periodand direct the diagnostic signal to the signal path during thediagnostic time period.

One or more of the following features may be included.

A coil may generate the external magnetic field.

The diagnostic circuit may be configured to generate the diagnosticsignal during one of: the diagnostic time period, the measured timeperiod, or both the diagnostic and measured time periods.

An analog-to-digital converter may be responsive to the measuredmagnetic field signal to generate a digital measured magnetic fieldsignal and responsive to the diagnostic signal to generate a digitaldiagnostic signal.

The analog-to-digital converter may comprise at least one integratorcircuit having a first capacitor configured to process the measuredmagnetic field signal and a second capacitor configured to process thediagnostic signal.

A controller may be configured to selectively couple the first capacitorto the signal path during the measured time period and couple the secondcapacitor to the signal path during the diagnostic time period.

An output signal generator may be responsive to the measured magneticfield signal and to the diagnostic signal to generate the sensor outputsignal.

The at least one magnetic field sensing element may comprise: a Halleffect element, a magnetoresistance element, or both.

In another embodiment, a magnetic field sensor comprises at least onemagnetic field sensing element configured to generate a measuredmagnetic field signal responsive to an external magnetic field; adiagnostic circuit configured to generate a diagnostic signal; a signalpath comprising a shared portion for processing the measured magneticfield signal to generate a sensor output signal indicative of theexternal magnetic field during a measured time period and for processingthe diagnostic signal to determine whether a fault is present during adiagnostic time period, and a dedicated portion for processing themeasured magnetic field signal during the measured time period; and acontroller configured to enable the dedicated signal path portion toprocess the diagnostic signal.

One or more of the following features may be included.

An analog-to-digital converter comprising at least one integrator may beincluded, wherein the dedicated signal path portion comprises a firstcapacitor dedicated to processing the measured magnetic field signal anda second capacitor dedicated to processing the diagnostic signal.

The controller may be configured to enable the dedicated signal pathportion to process the diagnostic signal during the diagnostic timeperiod.

The diagnostic circuit may be electrically coupled directly to the atleast one magnetic field sensing element to direct the diagnostic signalto the at least one magnetic field sensing element.

The diagnostic signal may be a power signal that drives the at least onemagnetic field sensing element.

In another embodiment, a magnetic field sensor comprises at least onemagnetic field sensing element configured to generate a measuredmagnetic field signal responsive to an external magnetic field; adiagnostic circuit configured to generate a diagnostic signal; amultiplexor coupled to receive the measured magnetic field signal andthe diagnostic signal as inputs, and provide either the magnetic fieldsignal or the diagnostic signal as an output; and a signal processingpath coupled to receive the output of the multiplexor and process themeasured magnetic field signal to generate a sensor output signalindicative of the external magnetic field during a measured time period,and process the diagnostic signal to determine whether a fault ispresent during a non-overlapping diagnostic time period.

One or more of the following features may be included.

A control circuit may be coupled to the multiplexor and configured tocause the multiplexor to provide the measured magnetic field signal asthe output during the measured time period, and provide the diagnosticsignal as the output during the diagnostic time period.

An analog-to-digital converter (ADC) may be responsive to the measuredmagnetic field signal to generate a digital measured magnetic fieldsignal and responsive to the diagnostic signal to generate a digitaldiagnostic signal.

The ADC may comprise a first ADC signal path for processing the measuredmagnetic field signal and a second ADC signal path for processing thediagnostic signal.

The control circuit may be configured to selectively couple the firstADC signal path to the signal processing path during the measured timeperiod and selectively couple the second ADC signal path to the signalprocessing path during the diagnostic time period.

The at least one magnetic field sensing element may be selected from aHall effect element, a magnetoresistance element, or both.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing features of the disclosure, as well as the disclosureitself may be more fully understood from the following detaileddescription of the drawings, in which:

FIG. 1 is a block diagram of a system including a magnetic field sensor.

FIG. 2 is a block diagram of a magnetic field sensor including anamplifier and a dual-path analog-to-digital converter.

FIG. 3. is a circuit diagram of a magnetic field sensing elementillustrating chopped or switched connections to the magnetic fieldsensing element.

FIG. 4 is a block diagram of a magnetic field sensor illustrating testcoverage.

FIG. 5 is a timing diagram of signals related to the magnetic fieldsensor of FIG.

FIG. 6 is a block diagram of an analog-to-digital converter.

FIG. 7 is a functional block diagram of an integrator circuit.

FIG. 8 is a circuit diagram of an integrator circuit.

FIG. 9 is a timing diagram of signals related to the integrator circuitof FIG. 8.

FIG. 10 is a block diagram of the magnetic field sensor including acalibration circuit.

FIG. 11 is a block diagram of the controller of FIG. 10.

FIG. 12 is block diagram illustrating a mathematical model of themagnetic field sensor of FIG. 10.

FIG. 13 is a flow diagram illustrating a calibration process of themagnetic field sensor of FIG. 10.

FIG. 14 is a block diagram of a magnetic field sensor including anamplifier, a dual-path analog-to-digital converter, and a diagnosticcircuit.

FIG. 15 is a timing diagram of signals and states related to themagnetic field sensor of FIG. 14.

FIG. 16 is a block diagram of a magnetic field sensor including anamplifier, a dual-path analog-to-digital converter, and a diagnosticcircuit.

FIG. 17 is a circuit diagram of a diagnostic circuit, a variable powersource, and a magnetic field sensing element.

DETAILED DESCRIPTION

As used herein, the term “magnetic field sensing element” is used todescribe a variety of electronic elements that can sense a magneticfield. The magnetic field sensing element can be, but is not limited to,a Hall Effect element, a magnetoresistance element, or amagnetotransistor. As is known, there are different types of Hall Effectelements, for example, a planar Hall element, a vertical Hall element,and a Circular Vertical Hall (CVH) element. As is also known, there aredifferent types of magnetoresistance elements, for example, asemiconductor magnetoresistance element such as Indium Antimonide(InSb), a giant magnetoresistance (GMR) element, an anisotropicmagnetoresistance element (AMR), a tunneling magnetoresistance (TMR)element, a magnetic tunnel junction (MTJ), a spin-valve, etc. Themagnetic field sensing element may be a single element or,alternatively, may include two or more magnetic field sensing elementsarranged in various configurations, e.g., a half bridge or full(Wheatstone) bridge. Depending on the device type and other applicationrequirements, the magnetic field sensing element may be a device made ofa type IV semiconductor material such as Silicon (Si) or Germanium (Ge),or a type III-V semiconductor material like Gallium-Arsenide (GaAs) oran Indium compound, e.g., Indium-Antimonide (InSb).

As is known, some of the above-described magnetic field sensing elementstend to have an axis of maximum sensitivity parallel to a substrate thatsupports the magnetic field sensing element, and others of theabove-described magnetic field sensing elements tend to have an axis ofmaximum sensitivity perpendicular to a substrate that supports themagnetic field sensing element. In particular, planar Hall elements tendto have axes of sensitivity perpendicular to a substrate, while metalbased or metallic magnetoresistance elements (e.g., GMR, TMR, AMR,spin-valve) and vertical Hall elements tend to have axes of sensitivityparallel to a substrate.

It will be appreciated by those of ordinary skill in the art that whilea substrate (e.g. a semiconductor substrate) is described as“supporting” the magnetic field sensing element, the element may bedisposed “over” or “on” the active semiconductor surface, or may beformed “in” or “as part of” the semiconductor substrate, depending uponthe type of magnetic field sensing element. For simplicity ofexplanation, while the embodiments described herein may utilize anysuitable type of magnetic field sensing elements, such elements will bedescribed here as being supported by the substrate.

As used herein, the term “magnetic field sensor” is used to describe acircuit that uses a magnetic field sensing element, generally incombination with other circuits. Magnetic field sensors are used in avariety of applications, including, but not limited to, an angle sensorthat senses an angle of a direction of a magnetic field, a currentsensor that senses a magnetic field generated by a current carried by acurrent-carrying conductor, a magnetic switch that senses the proximityof a ferromagnetic object, a rotation detector that senses passingferromagnetic articles, for example, magnetic domains of a ring magnetor a ferromagnetic target (e.g., gear teeth) where the magnetic fieldsensor may be used in combination with a back-biased or other magnet,and a magnetic field sensor that senses a magnetic field density of amagnetic field.

As used herein, the term “target” is used to describe an object to besensed or detected by a magnetic field sensor or magnetic field sensingelement. A target may be ferromagnetic or magnetic.

Turning to FIG. 1, a block diagram of a system 100 for detecting atarget 102 is shown to include a magnetic field sensor 104 placedadjacent to target 102 so that a magnetic field 106 can be sensed bymagnetic field sensor 104. In an embodiment, target 102 is a magnetictarget and produces external magnetic field 106. In another embodiment,magnetic field 106 is generated by a magnetic source (e.g. a back-biasmagnet or electromagnet) that is not physically coupled to target 102. Atarget 102 may be either a magnetic or a non-magnetic target. In theseinstances, as target 102 moves through or within magnetic field 106, itcauses perturbations to external magnetic field 106 that can be detectedby magnetic field sensor 104.

Magnetic field sensor 104 may detect and process changes in externalmagnetic field 106. For example, magnetic field sensor 104 may detectchanges in magnetic field 106 as target 102 rotates and features 105move closer to and away from magnetic field sensor 104, thus increasingand decreasing the strength of the magnetic field 106 sensed by magneticfield sensor 104. Magnetic field sensor 104 may include circuitry todetermine the speed, direction, proximity, angle, etc. of target 102based on these changes to magnetic field 106. Although magnetic target102 is shown as a toothed gear, other arrangements and shapes that canaffect magnetic field 106 as target 102 rotates are possible. Forexample, magnetic target 102 may have a non-symmetrical shape (such asan oval), may include sections of different material that affect themagnetic field, etc.

In an embodiment, magnetic sensor 104 is coupled to a computer 108,which may be a general purpose processor executing software or firmware,a custom processor, or a custom electronic circuit for processing outputsignal 104 a from magnetic sensor 104. Output signal 104 a may provideinformation about the speed, position, and/or direction of motion oftarget 102 to computer 108, which may then perform operations based onthe received information. In an embodiment, computer 108 is anautomotive computer (also referred to as an engine control unit)installed in a vehicle and target 102 is a moving part within thevehicle, such as a transmission shaft, a brake rotor, etc. Magneticsensor 104 detects the speed and direction of target 102 and computer108 controls automotive functions (like all-wheel drive, ABS,speedometer display control, etc.) in response to the informationprovided by magnetic field sensor 104.

In an embodiment, computer 108 may be located relatively distant frommagnetic field sensor 104. For example, computer 108 may be locatedunder the hood of a vehicle while magnetic field sensor 104 is locatedat a wheel or transmission element near the bottom and/or rear of thevehicle. In such an embodiment, having a serial communication interfacewith a minimal number of electrical connections (e.g. wires) betweencomputer 108 and magnetic field sensor 104 may be beneficial, and mayreduce cost and maintenance requirements.

In embodiments, where magnetic field sensor 104 operates as part of asystem that affects vehicular safety such as the brake or transmissionsystem, it may be desirable for magnetic field sensor 104 to performself-tests and report to computer 108 any errors or faults that occur.

In embodiments, magnetic field sensor 104 includes built-in self-test(“BIST”) circuits or processes that can test magnetic field sensor 104.The self-tests can include analog tests that test analog circuitportions of magnetic field sensor 104 and digital tests that testdigital circuit portions of magnetic field sensor 104. The self-testsmay also include test circuits or procedures that test both analog anddigital portions of magnetic field sensor 104. It may be desirable forthe self-tests to provide test coverage of magnetic field sensor 104that includes as many circuits as possible, in order to increase thetest coverage and effectiveness of the tests in finding faults.

Referring now to FIG. 2, a block diagram illustrates a circuit 200 thatmay be included in or as part of magnetic field sensor 104. Circuit 200may be configured to detect a magnetic field (such as magnetic field106) and process signals representing the detected magnetic field.Circuit 200 may also be configured to generate a reference magneticfield having a predetermined strength, and to perform self-tests by, forexample, processing signals related to the reference magnetic field andcomparing the processed signals to an expected value.

Circuit 200 includes one or more so-called signal paths, which is a paththrough circuit 200 over which a signal is propagated while the signalis being processed. For example, a signal may be generated by hallelement(s) 202, then propagated to amplifier 214, then propagated to ADC222 and through either converter circuit 234 or 236, and then finallypropagated to an output of ADC 222 as signal 224. In general, the termsignal path may refer to an electronic path, through one or morecircuits, though which a signal travels. The term signal path may beused to describe an entire path or a portion of a path through which thesignal travels.

In an embodiment, circuit 200 includes one or more magnetic fieldsensing elements (e.g. magnetic field sensing element 202) configured tomeasure an external magnetic field (such as magnetic field 106) andgenerate a measured magnetic field signal 204 that is responsive to theexternal magnetic field. Magnetic field sensing element 202 may also beconfigured measure a reference magnetic field and generate referencemagnetic field signal 206 in response to the reference magnetic field.In embodiments, magnetic field sensing element 202 may be a Hall effectelement, a magnetoresistive element, or another type of circuit orelement that can detect a magnetic field.

Circuit 200 may also include a coil 216 which may be located proximateto magnetic field sensing element 202. A driver circuit 218 may producea current that flows through coil 216 to produce the reference magneticfield mentioned above. The reference magnetic field may have apredetermined strength (e.g. a predetermined magnetic flux density) sothat reference magnetic field signal 206 has a known value and producespredicable results when processed by circuit 200.

In an embodiment, the reference magnetic field and the external magneticfield may have magnetic field directions that are opposite to eachother, or otherwise configured, so that they do not interfere with eachother. The reference magnetic field signal may be a differentialmagnetic field that averages out when the Hall plates are in anon-differential configuration. For example, magnetic field sensingelement 202 has an axis of maximum sensitivity that may be changed orswitched so that, in one arrangement, the axis of maximum sensitivity isaligned to allow magnetic field sensing element 202 to detect theexternal magnetic field 106 and, in another arrangement, the axis ofgreatest sensitivity is aligned to allow magnetic field sensing element202 to detect the reference magnetic field produced by coil 216.

In certain arrangements, coil 216 can be replaced by a permanent magnetor other magnetic source that can produce a predetermined referencemagnetic field that can be detected by magnetic field sensing element202.

Circuit 200 may also include a multiplexor 208, a chopping circuit 210,and/or other mechanisms or switch circuits that can switch a signal line(e.g. signal 212) so that measured magnetic field signal 204 is providedas an input to amplifier 214 during a measured time period and referencemagnetic field signal 206 is provided as an input to amplifier 214during a reference time period. An example of a chopping circuit isdescribed in U.S. patent application Ser. No. 13/398,127 (filed Feb. 16,2012), which is incorporated here by reference in its entirety.

Amplifier 214 is configured to receive and amplify measured magneticfield signal 204 during the measured time period, and to receive andamplify reference magnetic field signal 206 during the reference timeperiod. In an embodiment, signals 204 and 206 are differential signalsand amplifier 214 is a differential amplifier.

The output of amplifier 214 (i.e. amplified signal 220) may be an analogsignal in certain embodiments. Thus, circuit 200 may include ananalog-to-digital converter (“ADC”) circuit 222 coupled to receiveamplified signal 220 and convert it to a digital signal 224. Becauseamplifier 214 receives measured magnetic field signal 204 during ameasured time period, and receives reference magnetic field signal 206during a reference time period, amplified signal 220 may represent bothsignals at different times. It may represent measured magnetic fieldsignal 204 during the measured time period and may represent referencemagnetic field signal 206 during the reference time period.

ADC 222 may be referred to here as a so-called dual-path ADC because ADC222 may have some shared circuit portions that process both measuredmagnetic field signal 204 and reference magnetic field signal 206, andmay have other dedicated circuit portions that are configured to processeither measured magnetic field signal 204 or reference magnetic fieldsignal 206. For example, chopping circuits 226, 228, and 230 may beshared circuit portions that are configured to process both signals 204and 206. In contrast, converter circuit 234 may be configured to processmeasured magnetic field signal 204 while converter circuit 236 may beconfigured to process reference magnetic field signal 206. ADC 222 mayinclude multiplexors 238 and 240, or other switching circuits, that canselectively couple and de-couple converter circuits 234 and 236 from theother circuits included in ADC 222 so that converter circuit 234processes measured magnetic field signal 204 during the measured timeperiod and converter circuit 236 processes reference magnetic fieldsignal 206 during the reference time period.

In an embodiment, converter circuit 234 comprises one or more capacitorsthat are included in an integrator circuit, and converter circuit 236comprises one or more capacitors that are included in the sameintegrator circuit. As will be discussed below, ADC 222 may include oneor more integrator circuits each having at least two sets of one or morecapacitors each, a first set for processing measured magnetic fieldsignal 204 and a second set for processing reference magnetic fieldsignal 206. This will be discussed below in greater detail.

Periodically, the sets of capacitors can be swapped so that the firstset of capacitors processes the reference magnetic field signal 206 andthe second set of capacitors processes measured magnetic field signal204. If the reference magnetic field signal 206 is a test signal, thenswapping the capacitors can allow both sets of capacitors to process thetest signal and receive test coverage.

In operation, the measured time period and the reference time period arealternating, non-overlapping time periods, and circuit 200 processesmeasured magnetic field signal 204 and reference magnetic field signal206 in a time-division multiplexed (“TDM”) manner. For example, duringthe measured time period, multiplexor 208 may be configured to propagatemeasured magnetic field signal 204 through to amplifier 214, andmultiplexors 238 and 240 may be configured to couple converter circuit234 to the signal path and decouple converter circuit 236 from thesignal path. During the reference time period, multiplexor 208 may beconfigured to propagate reference magnetic field signal 206 through toamplifier 214, and multiplexors 238 and 240 may be configured to coupleconverter circuit 236 to the signal path and decouple converter circuit236 from the signal path.

In an embodiment, converter circuits 234 and 236 can be swapped, asdescribed above, after a predetermined number of time periods. If thereference magnetic field signal 206 is a test signal, this will allowboth converter circuits to be tested because, by swapping them, theywill each be exposed to and each process the test signal. Convertercircuits 234 and 236 may also be swapped in response to a commandreceived by the magnetic field sensor from computer 108, or in responseto any other schedule or trigger.

The magnetic field produced by coil 216 may have a known value, i.e. aknown strength or flux density. Thus, during the measured time period,amplified signal 220 and digital signal 224, which are ultimatelyderived from the magnetic field produced by coil 216 during the measuredtime period, may also have expected values. These expected values can becompared to predetermined test values to determine if there is a faultin circuit 200. Test coverage in circuit 200 may be increased becausemost of the circuitry, including amplifier 214, are shared circuits thatprocess both the measured magnetic field signal 204 and the referencemagnetic field signal 206. Using the test circuitry to process bothsignals increases accuracy and coverage of the test results.

Variations in silicon circuit fabrication can limit the accuracy of themeasurement of the reference signal generated by the coil 216. As anexample, variations in Hall plate fabrication (e.g., thickness ofsilicon doping, alignment of optical masks, etc.) may cause variationsin Hall plate sensitivity, or responsiveness to the reference magneticfield produced by coil 216. As another example, variations in resistorfabrication (e.g., impurity atoms in the silicon material) may causevariations, as a function of temperature for example, in the coilcurrent used to generate the reference field. Both variations can causethe measured reference field to stray from its expected value. It can bedifficult to determine if this error in the reference field measurementis due to variation in the fabrication process or is due to a failure inthe device. Therefore, after fabrication, the gain and/or offset of themeasured reference signal can be trimmed (i.e. adjusted), as a functionof temperature, so that it matches its expected value. In an embodiment,adjusting the gain and offset after fabrication includes setting orconfiguring a trimming circuit to perform the desired gain and/or offsetof the signal. Errors in the reference field measurement detected afterfactory trim are then detected as circuit failures rather thanvariations due to silicon fabrication.

Circuit 200 may also include a trim circuit 230 that can be used toshape digital signal 224. The trim circuit 230 may include digitalfilters, digital adders and multipliers, and other circuits that canadjust the gain and offset of the output reference magnetic field signal(e.g. the signal produced as a result of circuit 200 processing thereference magnetic field signal 206). In an embodiment, trim circuit 230may be an analog circuit containing analog filters and amplifiers, andmay be coupled between amplifier 214 and ADC 222. Trim circuit 230 mayalso include chopping circuits and/or other circuits to shape signal224. In other embodiments, trim circuit 230 may be included or embeddedas part of ADC 222, or may be included or embedded in circuitry thatcontrols the Hall plates. In the latter example, the trim circuitry mayadjust the current through the Hall plate in order to adjust the Hallplate's sensitivity. Adjusting digital signal 224 during the referencetime period can result in a more accurate test signal that can becompared, with greater accuracy, to the test limits described above.

Circuit 200 may also include a temperature sensor circuit (not shown inFIG. 2, but see FIG. 4) to sense the temperature of circuit 200. Theamount of gain and offset adjustment performed by trim circuit 230 maybe based on the temperature measured by the temperature sensor circuit.For example, if the temperature reading is high, trim circuit 230 mayapply more or less gain and offset adjustment than if the temperature islow, or vice versa.

Turning now to FIG. 3, a circuit diagram 300 illustrates switching of amagnetic field sensing element in order to allow the magnetic fieldsensing element to detect an external magnetic field and a referencemagnetic field. In diagram 300, magnetic field sensing element 303,which may be the same as or similar to magnetic field sensing element202, includes two Hall plates 304 and 305. Magnetic field sensingelement 303 is arranged so that a current 306 flows through Hall plate304 in a first direction (e.g. from the bottom left to the top right asshown in diagram 300), and the output voltage V_(OUT) of magnetic fieldsensing element 303 is taken across Hall plate 304 from the top left tothe bottom right. Magnetic field sensing element 303 is also arranged sothat a current 306 flows through Hall plate 305 in a first direction(e.g. from the top left to the bottom right as shown in diagram 300),and the output voltage V_(OUT) of magnetic field sensing element 303 istaken across Hall plate 305 from the top right to the bottom left. Inthis arrangement, the Hall plates 304 and 305 provide an average of thedetected external magnetic field 106 and reject the reference magneticfield. The axis of maximum sensitivity of the Hall plates may beconfigured to detect external magnetic field 106. I.e. with the current306 flowing in this direction, the axis of greatest sensitivity ofmagnetic field sensing element 304 may be aligned to detect externalmagnetic field 106. Thus, this arrangement may be used during themeasured time period to detect external magnetic field 106. Although notrequired, the driver circuit 218 that energizes coil 216 to produce thereference magnetic field may be disabled during measured time period sothat the reference magnetic field does not interfere with the detectionof external magnetic field 106 by magnetic field sensing element 303.

In diagram 302, Hall plate 304 may be switched so that current 306′flows from the top left to the bottom right, and the output voltageV_(OUT) of magnetic field sensing element 304 is taken across Hall plate304 from the bottom left to the top right. Additionally, Hall plate 305may be switched so that current 306′ also flows from the top left to thebottom right, but the output voltage V_(OUT) of magnetic field sensingelement 303 is taken across Hall plate 305 from the top right to thebottom left. In this arrangement, the Hall plates 304 and 305 may cancelor reject the external magnetic field 106 and provide an average of thereference magnetic field produced by coil 216. With the current 306′flowing in this direction, the axis of greatest sensitivity of Hallplate 304 may be aligned to detect the reference magnetic field producedby coil 216.

In an embodiment, the reference magnetic field produced by coil 216 is adifferential magnetic field, and the arrangements of Hall plates 304 and305 in diagram 302 allows magnetic field sensing element 303 to detectthe differential magnetic field. For example, current may flow throughat least a portion of coil 216 in the direction of arrow 308 to producea local magnetic field with a direction into the page near Hall plate304.

Current may also flow through another portion of coil 216 (or throughanother coil) in the direction of arrow 310 to produce a magnetic fieldwith a direction out of the page near Hall plate 305. In the arrangementshown in diagram 302, Hall plate 304 may be configured to detect themagnetic field produced by current flowing in direction 308 and having adirection into the page, and Hall plate 305 may be configured to detectthe magnetic field produced by the current flowing in direction 310 andhaving a direction out of the page. U.S. Pat. No. 8,680,846, which isincorporated here by reference, includes other examples of Hall plateconfigurations.

The illustrated configurations in FIG. 3 show one way to alternatelygenerate a reference magnetic field signal 206. In other embodiments,there may be other possible circuits and techniques that can generate areference magnetic field 206 that can be processed by circuit 200.

Referring now to FIG. 4, a block diagram of a circuit 400 illustratestest coverage of the circuit. Circuit 400 may be the same as or similarto circuit 200 in FIG. 2. In an embodiment, the circuit elements withinbox 402 may receive test coverage while circuit 200 processes referencemagnetic field signal 206. The elements may receive test coveragebecause they contribute to processing the reference magnetic fieldsignal. For example, if the processed referenced magnetic field signaldiffers from an expected value, it can be inferred that there is a faultin at least one of the elements that contributed to processing thesignal, i.e. at least one of the elements within box 402.

These elements, which the exception of capacitors 410, may be sharedelements, meaning that they are configured to process both measuredmagnetic field signal 204 and reference magnetic field signal 206. Theseelements include Hall driver circuits (not shown), coil driver circuits403, the magnetic field sensing elements 404, the amplifier 406, the ADC408, reference signal capacitors 410, and other circuits such asregulators, biasing circuits, temperature sensors, etc. In anembodiment, magnetic field sensing elements 404 may be the same as orsimilar to magnetic field sensing element 202, amplifier 406 may be thesame as or similar to amplifier 214, ADC 408 may be the same as orsimilar to ADC 222, and reference signal capacitors 410 may be the sameas or similar to converter circuit 236.

Measured signal capacitors 412, which may be the same as or similar toconverter circuit 234, are shown outside of test coverage box 402because they are configured to process the measured magnetic fieldsignal 204 and not the reference magnetic field signal 206. However, asdescribed above, these capacitors 410 and 412 may be periodicallyswapped so that capacitors 412 may periodically process the referencemagnetic field signal 206. Thus, test coverage may be extended tocapacitors 412 during the times when capacitors 412 are processing thereference magnetic field signal 206. Additional test circuitry andtechniques may also be included in magnetic field sensor 104 to testdigital portions of magnetic field sensor 104, such as logic BISTcircuits to test a digital controller and a dual-bit error check to testan EEPROM, for example.

Referring to FIG. 5, a timing diagram 414 illustrates signals associatedwith circuit 200 of FIG. 2. Signal 416 illustrates the alternating timeperiod. For example, time periods T1 and T3 correspond to a measuredtime period when circuit 200 is processing measured magnetic fieldsignal 204, and time periods T2 and T4 correspond to a reference timeperiod when circuit 200 is processing reference magnetic field signal206. Amplified signal 220 shown in the timing diagram is the outputsignal produced by amplifier 214. Clock signals 418 and 420 are internalclock signals of ADC 222. Clock signal 418 is used to process measuredmagnetic field signal 204 and may be active during time periods T1 andT3. Clock signal 420 is used to process reference magnetic field signal206 and may be active only time periods T2 and T4.

During time period T1, circuit 200 measures the external magnetic field106. For example, multiplexor 208 may couple measured magnetic fieldsignal 204 to the signal path during T1. Thus, during time period T1,signal 220 corresponds to measured magnetic field signal 204. Alsoduring T1, converter circuit 234 is enabled and used by ADC 222 toconvert signal 220 to a digital signal. During time period T2, circuit200 measures the reference magnetic field produced by coil 216. Forexample, multiplexor 208 may couple reference magnetic field signal 206to the signal path. Thus, during time period T2, signal 220 correspondsto reference magnetic field signal 206 during time period T2.

Although digital signal 224 is not shown in FIG. 5, digital signal 224is a digital-signal version of amplified signal 220 and should followamplified signal 220. In an embodiment, if reference signal 206 is atest signal with a known or expected value, then signal 220 and/ordigital signal 224 can be compared to a test value or threshold todetermine if there is a fault in circuit 200 in order to generate adiagnostic signal indicative of whether a fault is present. For example,a comparator or other circuit can compare signal 220 and/or signal 224to a test threshold. If one or both of the signals fall outside a rangeof expected test values, for example, it may indicate a fault in circuit200. Circuit 200 may also include a circuit that asserts a fault signalin the case of a fault. The fault signal may be received, for example,by computer 108 (FIG. 1) which may process and respond to the fault.

Referring to FIG. 6, ADC circuit 422 may be the same as or similar toADC 222 in FIG. 2. In an embodiment, ADC 422 is a sigma-delta typeanalog-to-digital converter having one or more integrator circuits (e.g.integrator circuits 424, 426, and 428) as shown. However, ADC circuit422 may be any type of analog-to-digital converter. Also, ADC 422 may bea so-called multi-path or dual-path analog-to-digital converter circuit.In other words, ADC 422 may include two or more signal paths including afirst signal path for processing measured magnetic field signal 204during a measured time period, and a second signal path for processingreference magnetic field signal 206 during a reference time period. Inan embodiment, the two or more signal paths are located in at least oneof the integrator circuits.

As mentioned above, the measured time period and the reference timeperiod may be alternating time periods. Accordingly, the first signalpath may be enabled (e.g. coupled to the main signal path) during themeasured time period and disabled (e.g. decoupled from the main signalpath) during the reference time period, and the second signal path maybe disabled during the measured time period and enabled during thereference time period.

Referring to FIG. 7, a functional block diagram 430 illustrates theoperation of a dual-path or multi-path integrator circuit 432.Integrator circuit 432 may be the same as or similar to any or all ofintegrator circuits 424, 426, and 428.

Integrator circuit 432 may include a first signal path comprisingconverter circuit 434 and configured to process measured magnetic fieldsignal 204, and a second signal path comprising converter circuit 436and configured to process reference magnetic field signal 206. Convertercircuits 434 and 436 may be the same as or similar to, or may form aportion of, converter circuits 234 and 236 in FIG. 2.

Converter circuits 434 and 436 may be analog memory elements formed bystoring a voltage charge on a switched capacitor. Each integrator may bea discrete time operation circuit where the previous output state of theintegrator is summed with the current input of the integrator to producethe next output state, as illustrated by feedback signal 450. Eachintegrator may have two or more analog memory elements, where eachmemory element can be used to process a different signal, and store avoltage charge associated with the signal while other signals are beingprocessed.

As shown in FIG. 7, Integrator circuit 430 may include a path selectsignal 438, a multiplexor 440, a clock signal 442, and logic AND gates444 and 446. Of course the logic gates can be replaced with any type oflogic gates or switch with equivalent functionality.

In operation, path select signal 438 can be used to enable and disableconverter circuits 434 and 436. When path select signal 438 is high,converter circuit 434 receives clock signal 442, converter circuit 436is disabled because it does not receive the clock signal, andmultiplexor 440 couples the output of converter circuit 434 to theoutput 448. When path select signal 438 is low, converter circuit 434 isdisabled because it does not receive clock signal 442, converter circuit436 is enabled because it receives clock signal 442, and multiplexor 440couples the output of converter circuit 436 to the output 448. In anembodiment, path select signal 438 may be high during the measured timeperiod to allow converter circuit 434 to process measured magnetic fieldsignal 204, and low during the reference time period to allow convertercircuit 436 to process reference magnetic field signal 206. Path selectsignal 438 can be inverted (e.g. high during the reference time periodand low during the measured time period) in order to swap convertercircuits 434 and 436 so they both receive test coverage, as describedabove.

Referring now to FIG. 8, a circuit diagram of an embodiment of anintegrator circuit 452 is coupled to receive input signal 453 andproduce output signal 462. Integrator circuit 452 may be animplementation or a subset of converter circuits 234 and 236. Integratorcircuit 452 may also be the same as or similar to integrator circuit432. Integrator circuit 452 includes a first signal path comprising oneor more first capacitors 454, and a second signal path comprising one ormore second capacitors 456. Note that while capacitors 454 and 456 areshown as single capacitors, it will be appreciated that capacitors 454and/or 456 can be multiple capacitors coupled in series, in parallel,capacitors arranged in a differential configuration (i.e. to receive adifferential signal), or in a combination of these.

Integrator circuit 452 may also have shared elements, such asoperational amplifier 464, used to process both measured magnetic fieldsignal 204 and reference magnetic field signal 206. In an embodiment,capacitors 454 are not shared circuit elements (i.e. are dedicatedelements). Capacitors 454 may be configured to process measured magneticfield signal 204 during the measured time period, and capacitors 456 maybe configured to process reference magnetic field signal 204 during thereference time period.

In an embodiment, a control circuit 460 controls switches swd toselectively couple and decouple capacitors 456 from the signal path, andcontrols switches swe to selectively couple and decouple capacitors 454from the signal path. Control circuit 460 also controls switches p1 andp2 to selectively couple shared input capacitor 458 to the invertinginput of the operational amplifier 464.

In operation, capacitors 454 are coupled to the signal path during themeasured time period and decoupled from the signal path during thereference time period, and capacitors 456 are coupled to the signal pathduring the reference time period and decoupled from the signal pathduring the measured time period. In an embodiment, switches swd open andclose at substantially the same time so that the voltage acrosscapacitors 456 is retained while capacitors 456 are decoupled from thesignal path, and switches swe open and close at substantially the sametime so that the voltage across capacitors 454 is retained whilecapacitors 454 are decoupled from the signal path.

Turning to FIG. 9, a timing diagram 466 includes signals associated withintegrator circuit 452. Signals p1, p2, swe, and swd described above areshown. The signal labeled V_(IN) may correspond to input signal 453 andthe signal labeled V_(OUT) may correspond to output signal 462.

Time periods T1 and T3 correspond to a measured time period during whichintegrator circuit 452 is processing measured magnetic field signal 204,and time periods T2 and T4 correspond to a reference time period duringwhich integrator circuit 452 is processing reference magnetic fieldsignal 206.

During period T1, signal swe is high so capacitors 454 are coupled tothe signal path and signal swd is low so capacitors 456 are decoupledfrom the signal path. V_(IN), which corresponds to the measured,external magnetic field 106 during time period T1, has a value greaterthan zero during period T1. As signals p1 and p2 couple and decoupleinput capacitor 458 to the inverting input of operational amplifier 464,the voltage across capacitors 454 will rise, as shown by the risingvalue of V_(OUT) during time period T1.

During period T2, signal swe is low so capacitors 454 are decoupled fromthe signal path and signal swd is high so capacitors 456 are coupled tothe signal path. In an embodiment, V_(OUT) initially changes to theprevious value stored on capacitors 456, which is zero in this example.V_(IN), which corresponds to the reference magnetic field produced bycoil 216 during time period T2, has a value greater than zero duringtime period T2. However, the amplitude of V_(IN) during time period T2is shown as lower than the amplitude during time period T1. In anembodiment, the lower amplitude may be due to the reference magneticfield having a relatively lower strength than the measured magneticfield 106. As signals p1 and p2 couple and decouple input capacitor 458to the inverting input of operational amplifier 464, the voltage acrosscapacitors 456 will rise, as shown by the rising value of V_(OUT) duringtime period T1. As shown in the figure, V_(OUT) may rise at a slowerrate during time period T2 due to the lower signal value V_(IN) duringthis time period.

During time period T3, when capacitors 454 are once again coupled to thesignal path, the V_(OUT) signal jumps to the same voltage level that ithad at the end of time period T1. This is because the voltage acrosscapacitors 454 was retained when capacitors 454 were decoupled from thesignal path at the end of time period T1.

In time period T3, V_(IN), which corresponds to the measured, externalmagnetic field 106 during time period T3, has a value less than zeroduring period T3. Thus, during time period T3, the voltage acrosscapacitors 454 decreases as shown by the decreasing value of the V_(OUT)signal.

During time period T4, when capacitors 456 are once again coupled to thesignal path, the V_(OUT) signal jumps to the same voltage level that ithad at the end of time period T2. This is because the voltage acrosscapacitors 456 was retained when capacitors 456 were decoupled from thesignal path at the end of time period T2.

In time period T4, V_(IN), which corresponds to the reference magneticfield produced by coil 216 during time period T4, has a value less thanzero during period T4. Thus, during time period T4, the voltage acrosscapacitors 456 decreases as shown by the decreasing value of the V_(OUT)signal. In this example, the value of V_(IN) may be smaller during T4than it is when processing the measured, external signal during T3.Thus, the value of the V_(OUT) signal may decrease at a relativelyslower rate during T4 than it does during T3.

If the reference magnetic field is being used as a test signal, thevoltage level across capacitors 456 (e.g. V_(OUT) during time periods T2and T4) can be compared to an expected value or expected threshold togenerate a diagnostic output signal that can indicate whether a fault ispresent, for example. If V_(OUT) falls outside of the threshold, a faultsignal can be generated. In addition, the voltage level acrosscapacitors 454, which corresponds to the measured magnetic field signal,can be processed to determine position, speed, direction, and otheraspects of magnetic target 102.

In an embodiment, the output signal of ADC 222 has a shape and/or valuethat is the same as or similar to the input signal to the ADC. Filteringthe output signal to remove high-frequency components can also shape theoutput signal so that it more closely resembles the input signal. Thus,the output signal from ADC 222 can be compared to the input signalduring the reference time period and. If the output signal deviates fromthe input signal by a predetermined amount or threshold, then a faultsignal can be generated indicating that a fault has been detected. Othermethods of generating the fault signal can also be used.

In an embodiment, capacitors 454 and 456 can periodically be swapped, sothat capacitors 454 are used to process the reference magnetic fieldsignal 206 during time periods T2 and T4, and capacitors 456 are used toprocess the measured magnetic field signal 204 during time periods T1and T2. This can ensure that both sets of capacitors are used at onetime or another to process the reference magnetic field signal, so thatboth sets of capacitors receive test coverage. The sets of capacitorscan be swapped according to a predetermined time schedule, in responseto a command received by magnetic field sensor 104, or according to anyother method that allows the sets of capacitors to be swapped. In anembodiment, control circuit 460 can swap capacitors 454 and 456 byswapping signals swe and swd.

In an embodiment, a reset signal (labeled as ‘reset’ in FIG. 9) isasserted between each transition between the measured and reference timeperiods. The reset signal may discharge any parasitic capacitors betweeneach transition, and reduce or eliminate residual signals from theprevious time period in order to reduce crosstalk and mixing between themeasured and reference magnetic field signals.

Also, at the beginning of each transition between time periods, theclock signal (labeled ‘adc_clk’) may be paused for a settling time toallow the magnetic field sensors, amplifier, and other circuits time tosettle. During this time, inputs and outputs of operational amplifier464 may be reset and capacitors 454 and 456 may be disconnected, i.e.decoupled from operational amplifier 464. In an embodiment, capacitors454 and 456 may also be reset if desired at power up or other times, byasserting the reset line while the capacitors are coupled to operationalamplifier 464.

After the settling time, signal swe becomes high and the integrator 452begins operation. Integrator operation includes sampling V_(IN) fromcapacitor 458 and transferring charge from C_(IN) to capacitor 454(during the measured time period) or capacitor 456 (during the referencetime period). Thus, with each sample, integrator 452 adds a scaledversion of the input signal to a previous output voltage level.

After a number of clock cycles, integrator 452 enters the reference timeperiod and processes the reference signal. In an embodiment, the numberof clock signals may be chosen to be large enough to allow for thesettling time and for oversampling of the signal being processed, andsmall enough to prevent leakage currents from altering the voltagestored on the capacitor 454 or 456 that is disconnected from operationalamplifier 464 and is not being processed. As shown in FIG. 9, the numberof clock cycles is six. However, any number of appropriate clock cyclesmay be chosen.

Signal V_(OUT) may be sampled and stored on capacitor 454 or 456 on thefalling edge of the clock adc_clk. At the end of measured time periodT1, the magnetic field sensing element may switch from a measured modeas shown in diagram 300 to a reference mode as shown in diagram 302 (SeeFIG. 3), and the inputs and outputs of operational amplifier 464 may bereset. At the rising edge of the swd signal, capacitor 456 may becoupled to operational amplifier 464 to allow integrator circuit 452 toprocess the reference magnetic field signal. As noted above, the slowerrise in V_(OUT) during time period T2 may be due to a smaller value ofthe diagnostic signal at V_(IN), which may correspond to the referencemagnetic field having a relatively lower strength. At the end of timeperiod T2, integrator 452 may enter measured time period T3 and onceagain process the measured magnetic field signal 204 in the mannerdescribed above. Finally, as shown in FIG. 9, at the end of time periodT3, integrator 452 may enter reference time period T4 and once againprocess the reference magnetic field signal 206 in the manner describedabove.

Referring to FIG. 10, a magnetic field sensor 500 includes a calibrationcircuit 510 that is responsive to a digital measured magnetic fieldsignal 512 and to a digital reference magnetic field signal 514 togenerate a calibrated magnetic field signal 520. The calibrated magneticfield signal 520 is further processed to generate an output signal 540of the sensor that is indicative of the external magnetic field.

The digital measured magnetic field signal 512 and the digital referencemagnetic field signal 514 can be the same as or similar to signals 204and 206 described above and thus, can be generated by switching betweenan external mode of operation in which a measured magnetic field signal516 is generated by magnetic field sensing elements 526, such as theillustrated Hall effect elements, under the control of a Hall driver 532and a reference mode of operation in which a reference magnetic fieldsignal 518 is generated by a reference coil 528 under the control of acoil driver 530. The reference coil 528 is configured to carry areference current to generate the reference magnetic field. At leastone, and in the illustrated embodiment two, magnetic field sensingelements 526 are thus configurable to generate the measured magneticfield signal 516 during a first time period and to generate thereference magnetic field signal 518 during a second, non-overlappingtime period.

As described above, the measured magnetic field signal and the referencemagnetic field signal may be processed by a Front End (FE) amplifier 524that may be the same as or similar to amplifier 214 of FIG. 2 andconverted into respective digital signals 512, 514 by ananalog-to-digital converter 536 using a fixed reference from a voltagereference 592, which converter 536 can be the same as or similar toconverter 222 of FIG. 2.

The digital measured magnetic field signal 512 is filtered by a filter544 to provide a filtered digital measured magnetic field signal 548(referred to herein alternatively as the digital measured magnetic fieldsignal) and the digital reference magnetic field signal 514 is filteredby a filter 546 to provide a filtered reference magnetic field signal550 (referred to herein alternatively as the digital reference magneticfield signal). In general, the digital measured magnetic field signal512 has a larger amplitude than the digital reference magnetic fieldsignal 514 and thus, filter 546 provides a higher degree of filteringthan filter 544 to more accurately distinguish the reference magneticfield signal in the presence of noise. Various types of filters arepossible. As one example, each of the filters 544, 546 is a decimationlow pass FIR filter.

The calibration circuit 510 is configured to combine the digitalmeasured magnetic field signal 548 and the digital reference magneticfield signal 550 in a manner that generates the calibrated magneticfield signal 520 with a reduced or eliminated dependence on certaininfluences on the magnetic field sensor 500. For example, in the case ofan integrated circuit magnetic field sensor 500, certain mechanicalstresses on the package due to temperature and humidity variations cancause the sensor output signal 540 to vary from its nominal, trimmedvalue for a given external magnetic field, thereby adversely affectingthe accuracy of the sensor. Operation of the calibration circuit 510 maybe controlled by a master control circuit 542 (which additionally maycontrol various other circuit functionality) and will be described ingreater detail in connection with FIGS. 11-13. Suffice it to say herethat the calibration circuit 510 operates on the digital measuredmagnetic field signal 548 in a manner dependent on the digital referencemagnetic field signal 550 to provide the calibrated signal 520 with areduced or eliminated dependence on certain adverse influences.

The calibrated magnetic field signal 520 may be processed by alinearization circuit 522 in certain applications. As one example, thecalibrated signal 520 may be transformed into a signal representative ofa position of a target by correlating values of the calibrated signal tovalues stored in a lookup table. The output of the linearization circuit522 may be clamped by a clamp 552 to limit the output to a programmablerange and further processed by a PWM/SENT encoder circuit 554 togenerate a signal having a PWM format with a programmable frequency or aSENT signal format. A multiplexer 556 can be used to select betweenproviding the output of the PWM/SENT circuit 554 or an output of aserial interface circuit 558 to an output signal generator 570.

Additional elements of the magnetic field sensor 500 can include ananalog Built-in-Self-Test (BIST) circuit 560 as may implement theabove-described techniques for diagnostic signal processing to detecterrors in the analog front end of the sensor, an EEPROM BIST circuit 562to test the EEPROM 594, and a logic BIST circuit 564 to test variouslogic functionality on the sensor IC 500.

The output signal generator 570 is coupled to the multiplexer 556 andincludes various elements used to reliably generate the sensor outputsignal 540 indicative of the external magnetic field, such as a slewcontrol circuit 572, an output driver 574, a current limit circuit 576,an ESD protection device 578, and a serial Receiver (RX) circuit 580. Inapplications in which the output signal 540 is provided in the SENTsignal format, the serial receiver 580 may implement bidirectionalcommunication as described in a U.S. Pat. No. 8,577,634, entitled“Systems and Methods for Synchronizing Sensor Data” which is assigned tothe assignee of the present disclosure and incorporated herein byreference in its entirety. The sensor 500 may further include additionalsupporting elements such as an EEPROM 594, a charge pump 582, aregulator and Power On Reset (POR) circuit 584, a level detector 586, anESD protection device 588 and, a clock generator 590.

A temperature sensor 596 senses the ambient temperature to which thesensor is subjected, converts the sensed temperature into a digitalsignal, and provides the digital sensed temperature signal 598 to atemperature filter and trim circuit 600 for further coupling to thecalibration circuit 510 as described below.

While the sensor 500 may be provided in the form of an integratedcircuit with an analog front end portion and a digital portion, it willbe appreciated that the particular delineation of which circuitfunctions are implemented in an analog fashion or with digital circuitryand signals can be varied. Further, some of the illustrated circuitfunctions can be implemented on an integrated circuit sensor 500 andother circuitry and functionality can be implemented on separatecircuits (e.g., additional substrates within the same integrated circuitpackage, or additional integrated circuit packages, and/or on circuitboards).

Referring also to FIG. 11 in which like elements are labeled with likereference characters, the calibration circuit 510 and certain otherelements of the sensor of FIG. 10 are shown. In particular, the filter544 (FIG. 10) that operates to filter the digital measured magneticfield signal 512 to provide the filtered digital measured magnetic fieldsignal 548 is here shown to include a decimation filter 602, an ADCfilter 604, and a bandwidth select filter 606, each providing low-passfiltering to reduce noise. In an embodiment, filter 602 decimates a 2MHz ADC signal to 128 kHz and provides some low-pass filtering. Slower(i.e., 128 kHz) processing consumes less power and silicon area. Filter604 provides additional low-pass filtering beyond what is feasible withthe decimation filter 602 and filter 606 provides additional low-passfiltering that is selectable by the customer in order to permit atrade-off to be made between noise performance and response time. Thereference path filter 546 (FIG. 10) that operates to filter the digitalreference magnetic field signal 514 to provide the filtered digitalreference magnetic field signal 550 may be a decimation filter. Theoutput of the bandwidth select filter 606 provides the filtered digitalmeasured magnetic field signal 548 and is shown to be coupled to thecalibration circuit 510 through a switch 608. The switch 608 illustratesthat in some embodiments, sampling of the signal 548 may be at apredetermined sample rate, such as the illustrated 16 kHz, oralternatively may be at a different rate such as in response to anexternal trigger signal as described in the above-referenced U.S. Pat.No. 8,577,634, for example.

The temperature filter and trim circuit 600 is here shown to include atemperature decimation filter 610 and a temperature sensor trim circuit612. The temperature sensor trim circuit 612 provides a trimmed factorytemperature signal 614 for use by a factory trim circuit 624 and areference trim circuit 640. The temperature sensor trim circuit alsoprovides a trimmed customer temperature signal 616 for use by a customertrim circuit 644. Various schemes are possible to trimming thetemperature signal 598.

A post-linearization circuit 618 can be coupled between thelinearization circuit 522 to introduce additional gain and offset trim,as may be useful to attenuate the signal to maintain usage of alllinearization points when using an output range that is not full-scalefor example.

The calibration circuit 510 receives the digital measured magnetic fieldsignal 548, the digital reference magnetic field signal 550, and thetrimmed temperature signals 614, 616 and generates the calibrated signal520, as shown. More particularly, the calibration circuit 510 includesfactory trim circuit 624 (referred to alternatively as a manufacturingtrim circuit) that receives the digital measured magnetic field signal548 and the trimmed temperature signal 614 and is configured to adjustat least one of a gain or an offset of the digital measured magneticfield signal based on a sensed temperature (i.e., based on the trimmedtemperature signal 614). More particularly, the factory trim circuit 624corrects for analog front end gain and offset variations due totemperature, such as by adding a temperature-dependent offset andmultiplying by a temperature-dependent gain factor, which factors may beprogrammed during a manufacturing test process. The factory trim circuit624 may additionally correct for temperature-independent offset and gainerrors in the analog front end signal path. Programmable trim valuesassociated with the factory trim circuit and any other trim circuits canbe programmed into EEPROM locations 594.

The calibration circuit 510 further includes a reference trim circuit640 that receives the digital reference magnetic field signal 550 andthe trimmed temperature signal 614 and provides a trimmed referencemagnetic field signal to a reference filter 642.

The reference trim circuit 640 is configured to adjust a gain of thereference magnetic field signal 550. In one embodiment, the referencetrim circuit 640 adjusts a gain of the digital reference magnetic fieldsignal based on a predetermined scale factor to facilitate signalprocessing by a combining circuit 630, as will be described. Thereference trim circuit 640 may further adjust at least one of the gainor an offset of the digital reference magnetic field signal based on asensed temperature (i.e., based on trimmed temperature signal 614) in amanner that is the same as or similar to the factory trim circuit 624.For example, the reference trim circuit 640 may correct for analog frontend gain and offset variations due to temperature by adding atemperature-dependent offset and multiplying by a temperature-dependentgain factor, which factors may be programmed during a manufacturing testprocess. The reference trim circuit 640 may additionally correct fortemperature-independent offset and gain errors in the analog front endsignal path. Again, programmable trim values can be programmed intoEEPROM locations 594.

The combining circuit 630 is configured to combine the digital measuredmagnetic field signal 548 and the digital reference magnetic fieldsignal 550 and, more particularly, may operate to combine the trimmedversion of these signals as labeled 626, 628, respectively, as shown. Inan embodiment general, the combining circuit 630 divides the measuredmagnetic field signal 626 by the reference magnetic field signal 628.The division operation can be accomplished in various ways. In theillustrative embodiment, a Taylor series expansion is used as will bedescribed.

The output of the combining circuit 630 may be further trimmed by acustomer trim circuit 644 in order to generate the calibrated magneticfield signal 520. The customer trim circuit 644 may be divided into asensitivity trim portion which multiplies the input signal by a userprogrammable temperature-dependent gain factor and an offset portionthat adds to its input a user programmable offset that is linearlydependent on temperature as a function of magnetic field strengths andoffsets in the customer's application. Further processing of thecalibrated signal 520 may be performed by linearization circuit 522,post-linearization circuit 618, clamp 552 and PWM/SENT encoder 554 (FIG.10).

Referring also to FIG. 12, a model of the magnetic field sensor 500(FIGS. 10 and 11) is shown to illustrate the principle of operation ofthe combining circuit 630. As explained above, much of the sensorcircuitry is shared between sensing and processing a magnetic fieldsignal based on an external magnetic field B_(EXT) and sensing andprocessing a magnetic field signal based on a reference magnetic fieldB_(CAL); however, for simplicity of explanation, these two signalprocessing functions are shown in the model of FIG. 12 as being separatesignal paths.

The one or more magnetic field sensing elements 526 (FIG. 10) arerepresented by model block 654 as being responsive to an externalmagnetic field B_(EXT) and a reference magnetic field B_(CAL) as may beprovided by a reference coil 528 (FIG. 10) for example. The referencemagnetic field B_(CAL) is modeled as a function of temperature (T)because it is generated by temperature-sensitive components. Themagnetic field sensing element is modeled with a temperature-dependentsensitivity k_(H1)(T) and a stress-dependent sensitivity multiplier ofk_(H2)(S), where “S” represents mechanical stress. Here, k_(H2)(S)represents the percentage change in nominal sensing element sensitivityk_(H2) due to stress, which is typically less than 3%. In other words,typically 0.97<k_(H2)(S)<1.03.

The amplifier 524 and analog-to-digital converter 536 (FIG. 10) aremodeled by respective blocks 658 and 662, each having atemperature-dependent gain k_(A)(T) and k_(D)(T), respectively. Theexternal filter 544 (FIG. 10) and the reference filter 546 (FIG. 10) aremodeled by respective blocks 666 and 672, each having atemperature-independent gain parameter k_(FE) and k_(FC), respectively.

The factory trim circuit 624 (FIG. 11) is modeled by a block 668 ashaving a temperature dependent gain k_(TE)(T). The reference trimcircuit 640 (FIG. 11) is modeled by a block 674 and includes atemperature dependent gain term k_(TC)(T). Block 674 includes anadditional term D_(REF) to represent a gain adjustment by apredetermined reference value, or scale factor used to facilitateoperation of the combining circuit 630 (FIG. 11). Reference valueD_(REF) may be chosen to be an exponent of two to facilitate a simpledivision operation (i.e., a bit-shift operation) by the reference trimcircuit 640.

The combining circuit 630 (FIG. 11) is modeled by a block 670 and isshown to compute D_(OUT), the quotient of the measured magnetic fieldsignal 626 and the reference magnetic field signal 628, for furthersignal processing. D_(OUT)=D_(NUM)/D_(DEN) can be represented as:

$\begin{matrix}{= \frac{k_{FE} \cdot {k_{H\; 1}(T)} \cdot {k_{A}(T)} \cdot {k_{D}(T)} \cdot {k_{TE}(T)} \cdot {k_{H\; 2}(S)} \cdot B_{EXT}}{k_{FC} \cdot {k_{H\; 1}(T)} \cdot {k_{A}(T)} \cdot {k_{D}(T)} \cdot {k_{TC}(T)} \cdot {k_{H\; 2}(S)} \cdot {{B_{EXT}(T)}/D_{REF}}}} & (1)\end{matrix}$

As noted above, the trim circuits 624, 640 are designed to reduce orremove the temperature dependence of the output signal. Accordingly, thek_(TE)(T) and k_(TC)(T) can be chosen so that:

k _(TE)(T)≈k _(NOM) ·[k _(FE) ·k _(H1)(T)·k _(A)(T)·k _(D)(T)]⁻¹  (2)

k _(TC)(T)≈D _(REF) ·[k _(FC) ·k _(H1)(T)·k _(A)(T)·k _(D)(T)·B_(EXT)(T)]⁻¹  (3)

where k_(NOM) is the nominal, or desired, sensitivity of the sensor,independent of temperature and stress. More particularly, k_(NOM)defines how many LSBs the device output should change by in the presenceof an input magnetic field change of 1 Gauss. According to equation (2),if the combined effect of the front-end parameters (which may bemeasured during manufacture) is known, then k_(TE) (as a function oftemperature) can be selected to make the sensitivity become k_(NOM), asdesired. A similar methodology can be used to select k_(TC).Substituting the latter expressions into the former and solving forD_(OUT) gives:

$\begin{matrix}{\begin{matrix}{D_{OUT} = \frac{D_{NUM}}{D_{DEN}}} \\{\approx \frac{k_{NOM} \cdot {k_{H_{2}}(S)} \cdot B_{EXT}}{k_{H_{2}}(S)}} \\{= {k_{NOM} \cdot B_{EXT}}}\end{matrix}\quad} & (4)\end{matrix}$

Thus, it will be appreciated that D_(OUT) becomes the desired response,with desired sensitivity k_(NOM), independent of temperature (T) andstress (S).

The model of FIG. 12 includes only operations that adjust the gain ofthe measured and reference signals. Temperature-dependent offsets alsoexist in the system, both as generated by inaccurate analog circuitcomponents and as included for compensating for inaccurate analogcircuit components by factory and reference trim blocks. These effectsare not included in the model to simplify the above analysis. It will beappreciated that these offset errors can be cancelled in a similar wayto the sensitivity error cancellations shown in Equations (2) through(4) above, resulting in a sensor output signal D_(OUT) that remainsindependent of stress effects.

The division operation performed by the combining circuit 630 (FIG. 11)can be simplified by forcing the divisor to be numerically close to one(e.g., within about 3%) as is achieved by the reference trim circuit 640adjusting the gain of the reference magnetic field signal by thepredetermined scale factor D_(REF). In particular, in one embodiment,the combining circuit 630 performs a division operation using a Taylorseries expansion that can be represented as follows:

$\begin{matrix}{\begin{matrix}{D_{OUT} = \frac{D_{NUM}}{D_{DEN}}} \\{\approx \frac{D_{NUM}}{1 - \left( {1 - D_{DEN}} \right)}} \\{= {D_{NUM} \cdot \left\lbrack {1 + \left( {1 - D_{DEN}} \right) + \left( {1 - D_{DEN}} \right)^{2} +} \right.}} \\\left. {\left( {1 - D_{DEN}} \right)^{3} + \cdots} \right\rbrack\end{matrix}\quad} & (5)\end{matrix}$

This expansion can be approximated with only a few terms if (1−D_(DEN))is numerically small relative to one. This is indeed the case, as1−D_(DEN)=1−k_(H2)(S), which represents the percentage change of theHall plate sensitivity due to stress, is typically less than 0.03 (3%)in magnitude, in other words, −0.03<1−k_(H2)(S)<+0.03.

In particular, the division operation can be expressed with sufficientaccuracy for most applications by using only three terms as follows:

D _(OUT) ≈D _(NUM)·[1+(1−D _(DEN))+(1−D _(DEN))²+(1−D _(DEN))³]  (6)

D _(OUT) ≈D _(NUM)·[1+X·(1+X·(1+X))]

where X=(1−D_(DEN)). This simplification is possible because thereference trim circuit 640 forces D_(DEN)≈1, thereby ensuring that thethree terms used in the Taylor series approximation provide a resultingcalibrated signal 520 that is accurate enough to track small changes inD_(DEN) due to stresses.

In one embodiment, the computation represented by equation (6) can beimplemented with a single shared multiplier, used three times. FIG. 13shows a flowchart illustrating a process for implementing the magneticfield sensor 500 (FIGS. 10 and 11) to calibrate a measured magneticfield signal. Rectangular elements, herein denoted “processing blocks,”represent computer software instructions or groups of instructions.Diamond shaped elements, herein denoted “decision blocks,” representcomputer software instructions, or groups of instructions, which affectthe execution of the computer software instructions represented by theprocessing blocks. Alternatively, the processing and decision blocksrepresent steps performed by functionally equivalent circuits such as adigital signal processor circuit or an application specific integratedcircuit (ASIC). The flow diagrams do not depict the syntax of anyparticular programming language. Rather, the flow diagrams illustratethe functional information one of ordinary skill in the art requires tofabricate circuits or to generate computer software to perform theprocessing required of the particular apparatus. It should be noted thatmany routine program elements, such as initialization of loops andvariables and the use of temporary variables are not shown. It will beappreciated by those of ordinary skill in the art that unless otherwiseindicated herein, the particular sequence of blocks described isillustrative only and can be varied without departing from the spirit ofthe invention. Thus, unless otherwise stated file blocks described beloware unordered meaning that, when possible, the steps can be performed inany convenient or desirable order.

The process 700 commences with a measured magnetic field signal (e.g.,signal 516 of FIG. 10) being generated in response to an externalmagnetic field at block 702, as may be achieved with the Hall effectelements 526 configured to respond only to an external magnetic field. Areference magnetic field signal (e.g., signal 518 of FIG. 10) isgenerated in response to a reference magnetic field at block 712, as mayalso be achieved with the Hall effect elements 526 configured to respondto reference magnetic field such as the reference magnetic fieldgenerated by reference coil 528. With the above-described configuration,the magnetic field sensing elements 526 are configured to generate themeasured magnetic field signal 516 during a first timer period and togenerate the reference magnetic field signal 518 during a second,non-overlapping time period.

The measured and reference magnetic field signals are converted todigital signals (e.g., signals 512, 514 of FIG. 10) in process blocks704 and 714, respectively, as may be achieved with the analog-to-digitalconverter 536 (FIG. 10), and the measured and reference magnetic fieldsignals may be filtered in blocks 706, 716, respectively, by filters544, 546 (e.g., to provide signals 548, 550 of FIG. 10). In processblock 708, at least one of a gain or offset of the external magneticfield signal 548 may be adjusted, such as by factory trim circuit 624(FIG. 11). In process block 718, a gain of the reference magnetic fieldsignal 550 may be adjusted by a predetermined scale factor and also oralternatively a gain or offset of the reference magnetic field signal550 may be adjusted, such as by reference trim circuit 640 (FIG. 11).The digital measured magnetic field signal 626 and the digital referencemagnetic field signal 628 are combined to generate a calibrated magneticfield signal in block 720, such as may be achieved by combining circuit630 (FIG. 11). Accordingly, in one embodiment, the digital measuredmagnetic field signal 626 is divided by the digital reference magneticfield signal 628. It will be appreciated that other schemes forcombining the digital measured magnetic field signal 626 and the digitalreference magnetic field signal 628 may be possible in order to stillachieve the reduction or elimination of stress influences on thegenerated calibrated signal. As an example, simple addition and/orsubtraction can be used. That is, taking an example where the referencesignal 628 is 2% greater than its expected value, the 2% can besubtracted from the measured signal 626. In process block 722, thecalibrated magnetic field signal (e.g., signal 520 in FIG. 10) is usedto generate the sensor output signal (e.g., signal 540 in FIG. 10).

The calibration process 700 may be performed at any time since therelated circuitry and processing is integrated within the sensor 500(e.g., on an integrated circuit sensor 500). Furthermore, the processsteps may be performed together or in stages. For example, some portionsof the signal processing may be performed during the manufacturingprocess (e.g., processing performed by the factory trim circuit 624, thecustomer trim circuit 644, the reference trim circuit 640, and/or thetemperature sensor trim circuit 612) while other signal processing(e.g., the signal combining by combining circuit 630) may be performedperiodically or in response to a command signal during use of the sensorafter it is installed in the intended environment.

It will be appreciated that processing blocks illustrated in FIG. 13 mayoccur simultaneously rather than sequentially and that the illustratedsequence can be varied in many instances. As one example, while thecalibration circuit 510 (FIGS. 10 and 11) is shown to process themeasured and reference magnetic field signals in the digital domain(after the analog-to-digital conversion by converter 536, it will beappreciated that the same calibration concepts can be applied in theanalog domain. For example, the division performed by the combiningcircuit 630 alternatively could be performed in the analog domain withthe use of an analog-to-digital converter that has as its input themeasured magnetic field signal 516 (FIG. 10) and as its reference thereference magnetic field signal 518. In such embodiments, it will beappreciated the analog-to-digital conversion blocks 704, 714 in FIG. 13can occur later in the process, after the measured magnetic field signalis divided by the reference magnetic field signal.

Referring now to FIG. 14, circuit 1400 may be included in or as part ofa magnetic field sensor system. Circuit 1400 may be configured to detecta magnetic field (such as magnetic field 106 in FIG. 1) and processsignals representing the detected magnetic field. For example, magneticfield sensing element(s) 1402 may detect the magnetic field and producesignal 1404 representing the detected magnetic field.

Circuit 1400 may include a diagnostic circuit 1406 to generate adiagnostic signal 1408. Circuit 1400 may perform self-tests by, forexample, processing diagnostic signal 1408 and comparing the processedsignals to an expected value. The diagnostic signal 1408 may be a DCsignal, a periodic signal, or any other signal that may produce anexpected result when processed by circuit 1400.

Circuit 1400 includes one or more so-called signal paths, which is apath through circuit 1400 over which a signal is propagated while thesignal is being processed. In the example shown in FIG. 14, the signalpath may include amplifier 1414 (which may be the same as or similar toamplifier 214), ADC 1422 (which may be the same as or similar to ADC222), and/or any other circuits that process signal 1404 and/or 1408.For example, signal 1404 may be generated by magnetic field sensingelement(s) 1402, then propagated to amplifier 1414, then propagated toADC 1422 and through either converter circuit 1434 or 1436, and thenfinally propagated to an output of ADC 1422 as signal 1424. In general,the term signal path may refer to an electronic path, through one ormore circuits, though which a signal travels. The term signal path maybe used to describe an entire path or a portion of a path through whichthe signal travels.

In an embodiment, circuit 1400 includes one or more magnetic fieldsensing elements 1402 configured to measure an external magnetic field(such as magnetic field 106) and generate a measured magnetic fieldsignal 1404 that is responsive to the external magnetic field.

A driver circuit 1410 may provide electrical power to magnetic fieldsensing element(s) 1402, which may allow magnetic field sensingelement(s) 1402 to detect the external magnetic field and produce signal1404.

Circuit 1400 may also include a switch 1412 that can selectively couplesignal 1404 and signal 1408 to the signal path 1416. The switch may be amultiplexor, a transistor, or any other type of switch that canselectively couple signal 1404 and signal 1408 to the signal path 1416.

Control circuit 1418 may contain logic to control switch 1412. Controlcircuit 1418 may be configured to couple signal 1404 to signal path 1416during a measured time period and couple signal 1408 to signal path 1416during a diagnostic time period. Although not shown, control circuit1418 may also be coupled to converter circuits 1434 and 1436, and toswitches 1438 and 1440, and/or to other circuit elements, to controlanalog-to-digital conversion of signals 1404 and 1408 during thedifferent time periods.

In embodiments, control circuit 1418 may effectuate a time-multiplexedscheme for processing signals 1404 and 1408. For example, during a firsttime period, control circuit 1418 may control switch 1412 so that signal1404 is directed to signal path 1416. During this time period, controlcircuit 1418 may control switches 1438 and 1440 so that the signal isdirected to converter circuit 1434. Also, during this time period,control circuit 1418 may enable converter circuit 1434 and disableconverter circuit 1436.

During a second time period, control circuit 1418 may control switch1412 so that diagnostic signal 1408 is directed to signal path 1416.During the second time period, control circuit 1418 may control switches1438 and 1440 so that the signal is directed to converter circuit 1436.Also, during this time period, control circuit 1418 may enable convertercircuit 1436 and disable converter circuit 1434.

Circuit 1400 may also include other circuits, which may or may not beshown, such as, amplifiers, filters, and/or other mechanisms or circuitsto process signal 1404 and 1408. An example of a chopping circuit isdescribed in U.S. patent application Ser. No. 13/398,127 (filed Feb. 16,2012), which is incorporated here by reference in its entirety.

Amplifier 1414 may be configured to receive and amplify magnetic fieldsignal 1404 during the measured time period, and to receive and amplifydiagnostic signal 1408 during the diagnostic time period. In anembodiment, signals 1404 and 1408 are differential signals and amplifier1414 is a differential amplifier. In other embodiments, signals 1404 and1408 are single-ended signals and amplifier 1414 is a single-endedsignal Amplifier.

The output of amplifier 1414 (i.e. amplified signal 1420) may be ananalog signal in certain embodiments. Thus, circuit 1400 may include ananalog-to-digital converter (“ADC”) circuit 1422 coupled to receiveamplified signal 1420 and convert it to a digital signal 1424. Becauseamplifier 1414 receives signal 1404 during a measured time period, andreceives diagnostic signal 1408 during a diagnostic time period,amplified signal 1420 may represent both signals at different times—itmay represent measured magnetic field signal 1404 during the measuredtime period and may represent reference magnetic field signal 1408during the reference time period.

ADC 1422, which may be the same as or similar to ADC 222, may bereferred to here as a so-called dual-path ADC because ADC 1422 may havesome shared circuit portions that process both measured magnetic fieldsignal 1404 and reference magnetic field signal 1408, and may have otherdedicated circuit portions that are configured to process eithermeasured magnetic field signal 1404 or reference magnetic field signal1408. For example, chopping circuits 1426, 1428, and 1430 may be sharedcircuit portions that are configured to process both signals 1404 and1408. In contrast, converter circuit 1434 may be configured to processmeasured magnetic field signal 1404 while converter circuit 1436 may beconfigured to process diagnostic signal 1408. ADC 1422 may includemultiplexors 1438 and 1440, or other switching circuits, that canselectively couple and de-couple converter circuits 1434 and 1436 fromthe other circuits included in ADC 1422 so that converter circuit 1434processes measured signal 1404 during the measured time period andconverter circuit 1436 processes diagnostic signal 1408 during thereference time period.

In an embodiment, converter circuit 1434 comprises one or morecapacitors that are included in an integrator circuit, and convertercircuit 1436 comprises one or more capacitors that are included in thesame integrator circuit. Like ADC 222 discussed above, ADC 1422 mayinclude one or more integrator circuits each having at least two sets ofone or more capacitors each: a first set for processing measured signal1404 and a second set for processing diagnostic signal 1408.

Periodically, the sets of capacitors can be swapped so that the firstset of capacitors processes the diagnostic signal 1408 and the secondset of capacitors processes measured signal 1404. Because signal 1408may be a test signal, swapping the capacitors can allow both sets ofcapacitors to process the test signal and receive test coverage.

In operation, the measured time period and the diagnostic time periodare alternating, non-overlapping time periods, and circuit 1400processes measured magnetic field signal 1404 and diagnostic signal 1408in a time-division multiplexed (“TDM”) manner. For example, during themeasured time period, switch 1412 may be configured to propagatemeasured signal 1404 through to amplifier 1414, and multiplexors 1438and 1440 may be configured to couple converter circuit 1434 to thesignal path 1416 and decouple converter circuit 1436 from the signalpath. During the diagnostic time period, switch 1412 may be configuredto propagate diagnostic signal 1408 through to amplifier 1414, andmultiplexors 1438 and 1440 may be configured to couple converter circuit1436 to the signal path 1416 and decouple converter circuit 1436 fromthe signal path 1416.

In an embodiment, converter circuits 1434 and 1436 can be swapped, asdescribed above, after a predetermined number of time periods. Becausesignal 1408 may be a test signal, this will allow both convertercircuits to be tested because, by swapping them, they will each beexposed to and each process the test signal. Converter circuits 1434 and1436 may also be swapped in response to a command received by themagnetic field sensor from computer 108, or in response to any otherschedule or trigger.

Diagnostic signal 1408 may have a known, expected value. Thus, duringthe diagnostic time period, amplified signal 1420 and digital signal1424, which are ultimately derived from diagnostic signal 1408 duringthe diagnostic time period, may also have expected values. Theseexpected values can be compared to predetermined test values todetermine if there is a fault in circuit 1400. Test coverage in circuit1400 may be increased because most of the circuitry, including amplifier1414, are shared circuits that process both the measured signal 1404 andthe diagnostic signal 1408. Using the test circuitry to process bothsignals increases accuracy and coverage of the test results.

Variations in silicon circuit fabrication can limit the accuracy of themeasurement of diagnostic signal 1408. As an example, variations in Hallplate fabrication (e.g., thickness of silicon doping, alignment ofoptical masks, etc.) may cause variations in Hall plate sensitivity. Asanother example, variations in resistor fabrication (e.g., impurityatoms in the silicon material) may cause variations, as a function oftemperature for example, in the coil current used to generate thereference field. Both variations can cause the diagnostic signal 1408 tostray from its expected value. It can be difficult to determine if thisis due to variation in the fabrication process or is due to a failure inthe device. Therefore, after fabrication, the gain and/or offset of thediagnostic signal 1408 can be trimmed (i.e. adjusted), as a function oftemperature, so that it matches its expected value. In an embodiment,adjusting the gain and offset after fabrication includes setting orconfiguring a trimming circuit to perform the desired gain and/or offsetof the signal 1408. Errors in the diagnostic signal measurement detectedafter factory trim are then detected as circuit failures rather thanvariations due to silicon fabrication.

Circuit 1400 may also include a trim circuit and a temperature sensorcircuit (not shown) to sense the temperature of circuit 1400 and adjustthe gain and offset of measured signal 1404 and/or diagnostic signal1408. The amount of gain and offset adjustment performed by the trimcircuit may be based on the temperature measured by a temperature sensorcircuit.

Referring to FIG. 15, timing diagram 1500 illustrates states of circuit1400 during alternating measured and diagnostic time periods. In timingdiagram 1500, the horizontal axis represents time, and time period block1502-1512 represents a measured time period or a diagnostic time period.Signal 1514 represents a control signal (for example a signal producedby control circuit 1418). In this example, when signal 1514 is low,circuit 1400 may process measured signal 1404 and, when signal 1514 ishigh, circuit 1400 may process diagnostic signal 1408. Thus, time periodblocks 1502, 1504, 1508, and 1510 may represent measured time periodsand time period blocks 1506 and 1508 may represent diagnostic timeperiod blocks.

In this example, two adjacent measured time periods (e.g. time periods1502 and 1504) precede each diagnostic time period (e.g. time period1506). However, in other arrangements any number of adjacent measuredtime periods may precede (or follow) any number of adjacent diagnostictime periods.

Referring to FIG. 16, circuit 1600 be included in or as part of amagnetic field sensor system. Circuit 1600 may be configured to detect amagnetic field (such as magnetic field 106 in FIG. 1) and processsignals representing the detected magnetic field. For example, magneticfield sensing element(s) 1402 may detect the magnetic field and producesignal 1602 representing the detected magnetic field.

A driver circuit 1604 may provide electrical power to magnetic fieldsensing element(s) 1402 by way of power signal 1605, which may allowmagnetic field sensing element(s) 1402 to detect the external magneticfield and produce signal 1602. Driver circuit 1604 may be a variabledriver circuit that can provide variable voltage and/or current tomagnetic field sensing element(s) 1402. In embodiments, the value ofdiagnostic power signal 1605 may change depending on whether circuit1600 is operating during the measured time period (i.e. the time periodwhere circuit 1600 is measuring and processing the external magneticfield) or the diagnostic time period (i.e. the time period where circuit1600 is processing a diagnostic or test signal). Power signal 1605 mayprovide normal power to magnetic field sensing element(s) 1402 duringthe measured time period, and may provide a diagnostic power signal tomagnetic field sensing element(s) 1402 during the diagnostic timeperiod.

During the measured time period, power signal 1605 may provide a normalpower level to magnetic field sensing element(s) 1402 so that they canoperate and sense the external magnetic field normally. In anembodiment, during the diagnostic time period, power signal 1605 mayprovide a low power level to magnetic field sensing element(s) 1402. Thelower power signal may be sufficiently low so that that magnetic fieldsensing element(s) 1402 provide a nominal output, but are not able tosense and react to the external magnetic field. Under thesecircumstances, changes in the external magnetic field may not affectsignal 1602 during the diagnostic time period. This may be beneficialwhen testing for errors in circuit 1600 because the signal 1602 may bepredictable (e.g. have a known value) if it is not affected by achanging, external magnetic field.

Circuit 1600 may include a diagnostic circuit 1606 to generate adiagnostic control signal 1608. Diagnostic control signal 1608 may be asignal that controls driver circuit 1604 and causes driver circuit 1604to provide a diagnostic power signal 1605. In this and similarembodiments, diagnostic control signal 1608 and/or diagnostic powersignal 1605 may be considered diagnostic signals. Circuit 1400 mayperform self-tests by, for example, processing diagnostic signal 1408and comparing the processed signals to an expected value. The diagnosticsignal may be a DC signal, a periodic signal, or any other signal thatmay produce an expected result when processed by circuit 1600.

Referring to FIG. 17, in an embodiment, diagnostic circuit 1606 may becoupled to a variable voltage source 1702 that provides power tomagnetic field sensing element(s) 1402. Diagnostic control signal 1608may control variable voltage source 1702 so that variable voltage sourcedrives magnetic field sensing element(s) 1402 with a first voltageduring the measured time period and with a second voltage during thediagnostic time period. In an embodiment, the second voltage is lowerthan the first voltage. One skilled in the art will recognize thatvariable voltage source 1702 may be replaced with a variable currentsource, a variable power source, a switch or multiplexor connected tomultiple power sources having different power levels, or any othercircuit that can switch or vary the power provided to magnetic fieldsensing element(s) 1402.

Elements of different embodiments described above may be combined toform other embodiments not specifically set forth above. Variouselements, which are described in the context of a single embodiment, mayalso be provided separately or in any suitable subcombination. Otherembodiments not specifically described herein are also within the scopeof the following claims.

All references cited in this disclosure are incorporated here byreference in their entireties.

Having described preferred embodiments, it will now become apparent toone of ordinary skill in the art that other embodiments incorporatingtheir concepts may be used. It is felt therefore that these embodimentsshould not be limited to disclosed embodiments, but rather should belimited only by the spirit and scope of the appended claims.

What is claimed is:
 1. A magnetic field sensor comprising: at least onemagnetic field sensing element configured to generate a measuredmagnetic field signal responsive to an external magnetic field; adiagnostic circuit configured to generate a diagnostic signal, whereinthe diagnostic signal is not dependent on a measured magnetic field; asignal path comprising an amplifier and an analog-to-digital converterfor processing the measured magnetic field signal to generate a sensoroutput signal indicative of the external magnetic field during ameasured time period and for processing the diagnostic signal during adiagnostic time period; and a switch coupled to receive the measuredmagnetic field signal and the diagnostic signal and direct the measuredmagnetic field signal to the signal path during the measured time periodand direct the diagnostic signal to the signal path during thediagnostic time period.
 2. The magnetic field sensor of claim 1 furthercomprising a coil to generate the external magnetic field.
 3. Themagnetic field sensor of claim 1 wherein the diagnostic circuit isconfigured to generate the diagnostic signal during one of: thediagnostic time period, the measured time period, or both the diagnosticand measured time periods.
 4. The magnetic field sensor of claim 1wherein the analog-to-digital converter is responsive to the measuredmagnetic field signal to generate a digital measured magnetic fieldsignal and responsive to the diagnostic signal to generate a digitaldiagnostic signal.
 5. The magnetic field sensor of claim 4 wherein theanalog-to-digital converter comprises at least one integrator circuithaving a first capacitor configured to process the measured magneticfield signal and a second capacitor configured to process the diagnosticsignal.
 6. The magnetic field sensor of claim 5 further comprising acontroller configured to selectively couple the first capacitor to thesignal path during the measured time period and couple the secondcapacitor to the signal path during the diagnostic time period.
 7. Themagnetic field signal of claim 1 further comprising an output signalgenerator responsive to the measured magnetic field signal and to thediagnostic signal to generate the sensor output signal.
 8. The magneticfield sensor of claim 1 wherein the at least one magnetic field sensingelement comprises: a Hall effect element, a magnetoresistance element,or both.
 9. A magnetic field sensor comprising: at least one magneticfield sensing element configured to generate a measured magnetic fieldsignal responsive to an external magnetic field; a diagnostic circuitconfigured to generate a diagnostic signal; a signal path comprising ashared portion for processing the measured magnetic field signal togenerate a sensor output signal indicative of the external magneticfield during a measured time period and for processing the diagnosticsignal to determine whether a fault is present during a diagnostic timeperiod, and a dedicated portion for processing the measured magneticfield signal during the measured time period; and a controllerconfigured to enable the dedicated signal path portion to process thediagnostic signal.
 10. The magnetic field sensor of claim 9 furthercomprising an analog-to-digital converter comprising at least oneintegrator and wherein the dedicated signal path portion comprises afirst capacitor dedicated to processing the measured magnetic fieldsignal and a second capacitor dedicated to processing the diagnosticsignal.
 11. The magnetic field sensor of claim 9 wherein the controlleris configured to enable the dedicated signal path portion to process thediagnostic signal during the diagnostic time period.
 12. The magneticfield sensor of claim 9 wherein the diagnostic circuit is electricallycoupled directly to the at least one magnetic field sensing element todirect the diagnostic signal to the at least one magnetic field sensingelement.
 13. The magnetic field sensor of claim 12 wherein thediagnostic signal is a power signal that drives the at least onemagnetic field sensing element.
 14. A magnetic field sensor comprising:at least one magnetic field sensing element configured to generate ameasured magnetic field signal responsive to an external magnetic field;a diagnostic circuit configured to generate a diagnostic signal; amultiplexor coupled to receive the measured magnetic field signal andthe diagnostic signal as inputs, and provide either the magnetic fieldsignal or the diagnostic signal as an output; and a signal processingpath coupled to receive the output of the multiplexor and process themeasured magnetic field signal to generate a sensor output signalindicative of the external magnetic field during a measured time period,and process the diagnostic signal to determine whether a fault ispresent during a non-overlapping diagnostic time period.
 15. Themagnetic field sensor of claim 14 further comprising a control circuitcoupled to the multiplexor and configured to cause the multiplexor toprovide the measured magnetic field signal as the output during themeasured time period, and provide the diagnostic signal as the outputduring the diagnostic time period.
 16. The magnetic field sensor ofclaim 15 further comprising an analog-to-digital converter (ADC)responsive to the measured magnetic field signal to generate a digitalmeasured magnetic field signal and responsive to the diagnostic signalto generate a digital diagnostic signal.
 17. The magnetic field sensorof claim 16 wherein the ADC comprises a first ADC signal path forprocessing the measured magnetic field signal and a second ADC signalpath for processing the diagnostic signal.
 18. The magnetic field sensorof claim 17 wherein the control circuit is configured to selectivelycouple the first ADC signal path to the signal processing path duringthe measured time period and selectively couple the second ADC signalpath to the signal processing path during the diagnostic time period.19. The magnetic field sensor of claim 14 wherein the at least onemagnetic field sensing element is selected from a Hall effect element, amagnetoresistance element, or both.